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PC922
PC922
s Features
1. Built-in base amplifier for inverter drive 2. High power ( IO1: MAX. 0.5A ( DC ) ) (IO2P : MAX. 2.0A ( pulse ) ) 3. High isolation voltage between input and output ( Viso : 5 000V rms ) 4. High noise reduction type 5. High speed response ( t PHL , t PLH : MAX. 5 s ) 6. High sensitivity ( IFLH : MAX. 3mA ) 7. Recognized by UL, file No. E64380
High Power OPIC Photocoupler
g Lead forming type ( I type ) and taping reel type ( P type ) are also available. ( PC922I/PC922P) gg TUV ( VDE 0884 ) approved type is also available as an option.
s Outline Dimensions
( Unit : mm )
Internal connection diagram 1.2 0.3 8 6.5 0.5 7 PC922 Amp 1 2 3 4 1 2 3 4 0.85 0.2 6 5 8 7
Tr1
6
Tr2
5 Interface
Anode mark
3.4 0.5
1. Inverter controlled air conditioners 2. Small capacitance general purpose inverters
0.5TYP.
3.5 0.5
s Applications
9.66 0.5
7.62 0.3
0.5 0.1
2.54 0.25
0.26 0.1 = 0 to 13
1 Anode 2 Cachode 3 NC
4 NC 5 O1 6 O2
7 GND 8 V CC
* " OPIC " ( Optical IC ) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and signalprocessing circuit integrated onto a single chip.
s Absolute Maximum Ratings
Input Parameter Forward current *1 Reverse voltage Supply voltage O1 output current *2 O1 peak output current O2 output current *2 O2 peak output current O1 output voltage Power dissipation Total power dissipation *3 Isolation voltage Operating temperature Storage temperature *4 Soldering temperature
( Ta = Topr unless otherwise specified)
Symbol IF VR V CC IO1 IO1P IO2 IO2P VO1 PO P tot V iso T opr T stg T sol Rating 25 6 18 0.5 1.0 0.6 2.0 18 500 550 5 000 - 20 to + 80 - 55 to + 125 260 Unit mA V V A A A A V mW mW V rms C C C
Output
*1 Ta = 25C *2 Pulse width <= 5 s, Duty ratio : 0.01 *3 40 to 60% RH, AC for 1 minute, Ta = 25C *4 For 10 seconds
" In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device. "
PC922 s Electro-optical Characteristics
Parameter Forward voltage Input Reverse current Terminal capacitance Operating supply voltage O1 low level output voltage O2 high level output voltage Output O2 low level output voltage O1 leak current O2 leak current High level supply current Low level supply current
*5
( Ta = T opr unless otherwise specified )
Conditions T a = 25C, I F = 5mA T a = 25C, I F = 0.2mA T a = 25C, V R = 3V T a = 25C, V = 0, f = 1kHz VCC = 6V, I O1 = 0.4A, RL2 = 10 , I F = 5mA VCC = 6V, I O2 = - 0.4A, IF = 5mA VCC = 6V, I O2 = 0.5A, I F = 0 VCC = 13V, I F = 0 VCC = 13V, I F = 5mA T a = 25C, V CC = 6V, I F = 5mA VCC = 6V, I F = 5mA T a = 25C, V CC = 6V, I F = 0 VCC = 6V, I F = 0 T a = 25C, V CC = 6V, RL1 = 5 , R L2 = 10 VCC = 6V, R L1 = 5 RL2 = 10 Ta = 25C, DC = 500V 40 to 60% RH T a = 25C, V CC = 6V IF = 5mA R L1 = 5 RL2 = 10
T a = 25C, V CM = 600V (peak ) I F = 5mA, R L1 = 470 , R L2 = 1k , T a = 25C, V CM = 600V (peak ) I F = 0, R L1 = 470 , R L2 = 1k
Symbol V F1 V F2 IR Ct V CC V O1L V O2H V O2L IO1L IO2L ICCH ICCL
MIN. 0.6 5.4 4.5 0.3 0.2 5 x1010 -1 500 1 500
TYP. 1.1 0.9 30 0.2 5.0 0.2 9 11 1.5 10 11 2 2 0.2 0.1 -
MAX. 1.4 10 250 13 0.4 0.4 200 200 13 17 15 20 3.0 5.0 5 5 1 1 -
Unit V V A
pF
Fig.
1 2 3 4 5 5 -
V V V V A A mA mA mA mA mA mA s s s s V/ s V/ s
" LowHigh " threshold input current
I FLH
Transfer Isolation resistance charac"LowHigh " propagation delay time teristics "HighLow " propagation delay time Rise time Fall time Response time
Instantaneous common mode rejection voltage "Output : High level " Instantaneous common mode rejection voltage "Output : Low level "
R ISO t PLH t PHL tr tf CMH CML
6
V O2H = 0.5V V O2L = 0.5V
7 7
*5 I FLH represents forward current when output goes from low to high.
s Truth Table
Input ON OFF O2 Output High level Low level Tr. 1 ON OFF Tr. 2 OFF ON
PC922 s Test Circuit
Fig. 1
1 8 5 PC922 IF 2 6 RL2 7 IO1 2 7 V IF VCC PC922 6 V
Fig. 2
1 8 5 IO2 VCC
Fig. 3
1 8 A 5 PC922 IF 2 6 7 VCC
Fig. 4
1 8 5 PC922 IF 2 6 7 A VCC
Fig. 5
A 1 8 RL1 5 PC922 IF variable 2 6 RL2 7 V VCC
Fig. 6
1 t r = tf= 0.01 s ZO = 50 VIN PC922 6 RL2 47 VIN waveform 1 SW 8 RL1 5 PC922 6 RL2 2 VCM 7 VO2 VCC 90% VO2 waveform 10% tr tf tPLH tPHL 2 7 8 RL1 5 VO2 VCC
Fig. 7
50%
A
B
50%
+
-
Fig. 8 Forward Current vs. Ambient Temperature
30 25 Forward current I F ( mA )
VCM waveform
VCM (peak) GND
20
15
CMH V O2 waveform SW at A, I F = 3mA VO2H VO2L
VO2H
10
5 0 - 25 - 20
CMH V O2 waveform SW at B, I F =0
VO2L GND
0
25 50 75 80 Ambient temperature T a ( C )
100
PC922
Fig. 9-a Power Dissipation vs. Ambient Temperature
600
Fig. 9-b Power Dissipation vs. Ambient Temperature
600 550
500 Power dissipation P tot ( mW ) 0 25 50 75 80 100 Power dissipation P O ( mW )
500
400
400
300
300
200
200
100 0 - 20
100 0 - 20
0
25
50
75 80
100
Ambient temperature T a ( C )
Ambient temperature T a ( C )
Fig. 10 Forward Current vs. Forward Voltage
500 200 Forward current I F ( mA ) 100 50 20 10 5 2 1 T a = 75C
Fig.11 " Low High " Relative Threshold Input Current vs. Supply Voltage
1.2 V CC = 6V I FLH = 1 T a = 25C
0C - 20C
Relative threshold input current
50C
25C
1.1
1.0
0.9
0.8
0.7 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4 6 8 10 12 14 Forward voltage V F ( V ) Supply voltage VCC ( V )
Fig.12 " Low High " Relative Threshold Input Current vs. Ambient Temperature
1.6 V CC = 6V I FHL = 1 T a = 25C
Fig.13 O 1 Low Level Output Voltage vs. O 1 Output Current
0.4 O1 Low level output voltage VO1L ( V ) V CC = 6V R L2 = 10 I F = 5mA T a = 25C
Relative threshold input current
1.4
0.2
0.1 0.05
1.2
1.0
0.02
0.8
0.01 0.005
0.6 - 25
0
75 Ambient temperature T a ( C )
25
50
100
0.01
0.02
0.05
0.1
0.2
0.5
1.0
O1 Output current I O1 ( A )
PC922
Fig.14 O 1 Low Level Output Voltage vs. Ambient Temperature
0.5 O1 Low level output voltage VO1L ( V ) O2 high level output voltage V O2H ( V ) V CC = 6V R L2 = 10 0.4
Fig.15 O 2 High Level Output Voltage vs. O2 Output Current
5.4 V CC = 6V I F = 5mA T a = 25C
5.3
5.2
0.3
I O1 = 0.5A 0.4A
5.1
0.2
5.0
0.1 0.1A 0 - 25
4.9 4.8
0
25
50
75
100
0
- 0.1
Ambient temperature T a ( C )
- 0.2 - 0.3 - 0.4 - 0.5 O2 output currrent I O2 ( A )
- 0.6
Fig.16 O2 High Level Output Voltage vs. Ambient Temperature
5.4 V CC = 6V O2 high level output voltage VO2H ( V )
Fig.17 O2 Low Level Output Voltage vs. O2 Output Current
0.4 O2 Low level output voltage VO2L ( V ) 0.2 0.1 V CC = 6V T a = 25C
5.3 I O2 = - 0.1A 5.2
0.05
5.1 - 0.4A 5.0 - 0.5A 4.9 4.8 - 25
0.02 0.01
0 25 50 75 Ambient temperature T a ( C )
100
0.005 0.01
0.02
0.05 0.1 0.2 O2 output current I 2 ( A )
0.5
1.0
Fig.18 O2 Low Level Output Voltage vs. Ambient Temperature
0.5 O2 Low level output voltage V O2L ( V ) V CC = 6V 0.4
Fig.19 High Level Supply Current vs. Supply Voltage
14 High level supply current I CCH ( mA ) T a = - 20C 12
0.3
I O2 = 0.6A 0.5A
25C 10 80C
0.2
8
0.1 0.1A 0 - 25
6
0
25
50
75
100
4 4
6
8
10
12
14
Ambient temperature T a ( C )
Supply voltage V CC ( V )
PC922
Fig.20 Low Level Supply Current vs. Supply Voltage
16 T a = - 20C Low level supply current I CCL ( mA ) 14
Fig.21 Propagation Delay Time vs. Forward Current
( s ) 6 V CC = 6V R L1 = 5 R L2 = 10
PLH
5
Propagation delay time t PHL , t
4
12
25C
t PHL T a = 80C
3
25C - 20C t PLH T a = 80C 25C - 20C 0 5 10 15 20 Forward current I F ( mA ) 25
10 80C 8
2
1 0
6 4 6 8 10 12 Supply voltage V CC ( V ) 14
Fig.22 Propagation Delay Time vs. Ambient Temperature
5 s ) V CC = 6V R L1 = 5 R L2 = 10 I F = 5mA
Fig.23 O 2 Peak Output Current vs. O2 Low Level Output Voltage
10 5 O2 peak output current I O2P ( A ) I02 MAX. ( Pulse )
*Single osc.pulse T a = 25C
PLH (
4
100ms * 10ms *
,t
1ms *
PHL
2
Propagation delay time t
3 t PLH 2 t PHL 1
1 I02MAX. ( Continuous ) 0.5 1s* DC 0.2 0.1 0.2 DC ( T a = 80C) 0.5 1 2 5 10
V CC ( MAX. )
0 - 25
0
75 Ambient temperature T a ( C )
25
50
100
20
O2 low level output voltage VO2L ( V )
s Application Circuit
VCC + 5V Anode PC922 O1 O2 GND TTL, microcomputer, etc. + E + 6V B Power transistor module Load C
Cathode
s Precautions for Use
( 1 ) It is recommended that a by-pass capacitor of more than 0.01 F is added between VCC and GND near the device in order to stabilize power supply line. ( 2 ) Handle this product the same as with other integrated circuits against static electricity. ( 3 ) As for other general cautions, refer to the chapter " Precautions for Use " .

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